Surface mount technology forms the backbone in the manufacturing of high-density electronics. This methodology involves mounting electronic components directly onto the surface of a printed circuit board (PCB). The inherent advantages of SMT, such as its small footprint, high component density, and

Injection molding has emerged as a critical process in the electronics manufacturing industry, enabling manufacturers to produce complex electronic components with high precision and efficiency. This technique involves injecting molten plastic into a mold cavity, where it cools and solidifies, formi